Consultation and engineering support across semiconductor processes, analysis, packaging and characterization.
Tell us what you are working on, where the difficulty lies and what a useful outcome would look like.
Frame the failure question, review available evidence and discuss an appropriate investigation approach. Analysis methods and reporting requirements are agreed to suit the issue and available resources.
Discuss this capability ↗Discuss fabrication process questions, process interactions and opportunities for structured investigation. Support is scoped around the process information and operating context you can share.
Discuss this capability ↗Explore technical issues across assembly, package-related processes and test. Define the problem, relevant data and the support needed for the next stage of evaluation.
Discuss this capability ↗Discuss measurement and characterization needs, sample requirements and intended outputs. Facility access, equipment, methods and any external laboratory arrangements must be confirmed for the engagement.
Discuss this capability ↗Scope support for package-related engineering questions, technical reviews and issue investigation. Deliverables and responsibility boundaries are defined before work begins.
Discuss this capability ↗Review a defined process challenge, structure the available evidence and discuss improvement options. Advisory support focuses on agreed technical questions and practical next actions.
Discuss this capability ↗Please keep the initial enquiry non-confidential. Secure handling arrangements can be discussed before detailed technical information is shared.
The process, product or engineering question you need to address.
A high-level description of symptoms, constraints and information already available.
The expected output, timing and boundaries of a potential engagement.
